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IPI HTRF 50 Release Film is a High Temperature Resistant Release Film, which is chemically engineered for use in high quality laminating processes.
HTRF 50 film is grainless, translucent, and odorless. HTRF 50 is highly resistant to grease and oil, has a high thermal stability, good folding endurance, and a high dielectric constant.
Its superior thermal stability and temperature resistance of up to 410ºF (210ºC) makes it the choice Release Film in the process of laminating rigid and flexible printed circuit boards.
HTRF 50 has a high quality uniform matte surface, which conveys the same uniform matte surface on the cured resin. The high quality of its surface finish provides an excellent release from polyester, epoxy, acrylic, and phenolic resins, as well as various rubber compounds.
HTRF 50 Release Film contains no traces of silicone and provides an extremely dry and easy release without any plate residue.
| Temperature: |
390ºF |
| Cycle Time: |
135 minutes |
| Pressure: |
400 to 900 PSI |
| Stacking: |
8-12 layers 51” x 51” |
HTRF 50 is produced in master rolls 51” (1300 mm) wide and can be slit into smaller rolls.
Technical Specifications:
| Properties |
Units |
Values |
| |
|
Min |
Max |
| Color |
|
Red |
| Thickness |
μ |
45 |
55 |
| Temperature Resistance |
ºF (ºC) |
|
410ºF (210ºC) |
| Surface Roughness |
μ |
3.5 |
4.5 |
| Residual Humidity |
% |
|
3 |
| Residual Solvent |
% |
|
1.5 |
Mechanical Properties |
Units |
Specific Value |
Method |
Elastic Module |
CD/MD |
Mpa |
3500±200 |
ASTM D882-2 |
Tensile Strength at Break |
CD/MD |
Mpa |
110±10 |
ASTM D882-2 |
Tensile Strength |
CD/MD |
Mpa |
110±10 |
ASTM D882-2 |
Percent Elongation at Break |
CD/MD |
% |
30±5 |
ASTM D882-2 |
Yield Strength |
CD/MD |
Mpa |
85±5 |
ASTM D882-2 |
Percent Elongation at Yield |
CD/MD |
% |
5±2 |
ASTM D882-2 |
Island Pyrochemical Industries provides this product specification sheet solely for informational purposes.
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